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Product details
| Parameters | performance | notes | |
| minimum value | Maximum value | ||
| Power supply voltage (V) | 3.3 | 5.5 | Module permanently burned out beyond 6V |
| PA driving voltage (V) | 7.4 | 7.6 | Default 7.5V power supply for full power output |
| Blocking power (dBm) | - | lOdbm | High power modules have a higher probability of burning out when used in close proximity |
| Working temperature (℃) | -40 | 85 | Industrial grade |
| Parameters | performance | notes | |||
| minimum value | Typical values | Maximum value | |||
| Power supply voltage (V) | 3.3 | 5 | 5.5 | ≥ 4.7V can ensure output power | |
| PA control voltage (V) | 7.4 | 7.5 | 7.6 | Recommend using 7.5V to ensure optimal performance | |
| Working temperature (℃) | -40 | 25 | 85 | Industrial grade design | |
| Working frequency band (MHEz) | 410 | - | 493 | ISM band | |
| power waste | Emission current (mA) | 1400 | 1500 | 1600 | Instantaneous power of 37dBm (tested with a power supply voltage of 5V and a PA voltage of 7.5V) |
| Receiving current (mA) | 6.5 | 8 | -100dBm input current 8mA | ||
| Sleep current (uA) | 3 | T/RX_EN = o | |||
| Maximum transmission power (dBm) | 36 | 37 | 38 | Front stage input power greater than 17dEm can ensure full power output | |
| Receiving gain (dBm) | 14 | 15 | 17 | -100dBm input | |
| Parameters | describe | notes |
| Reference distance | 20Km | Clear and open environment, antenna gain of 5dBi, antenna height of 2 meters, air speed of 2.4kbps |
| Packaging method | Surface mount type | / |
| Interface method | 1.5mm | Stamp hole |
| External dimensions | 45*30mm | l |
| RF input/output interface | Stamp hole/IPX | Equivalent impedance is about 509 |
| Pin number | Pin Name | Pin direction | Pin usage |
| 1 | GND | - | Ground wire, connected to the reference ground |
| 2 | +7.5V | - | PA driver power supply VCC1 |
| 3 | +7.5V | - | PA driver power supply VCC1 |
| 4 | GND | - | Ground wire, connected to the reference ground |
| 5 | +5V | - | Control power supply VCC2 |
| 6 | GND | - | Ground wire, connected to the reference ground |
| 7 | TXEN | input | Enable transmission mode, high level active (supports 3.3V/5V levels) |
| 8 | RXEN | input | Reception mode enabled, high level active (supports 3.3V/5V levels) |
| 9 | GND | - | Ground wire, connected to the reference ground |
| 10 | PIN | input/output | Transmission mode: RF signal input/reception mode: RF signal output |
| 11 | PoUT | Output/Input | Transmission mode: RF signal output/reception mode: RF signal input |
| 12 | GND | - | Ground wire, connected to the reference ground |
| 13 | GND | - | Ground wire, connected to the reference ground |
| 14 | GND | - | Ground wire, connected to the reference ground |
| 15 | GND | - | Ground wire, connected to the reference ground |
| 16 | GND | - | Ground wire, connected to the reference ground |
| 17 | GND | - | Bottom heat dissipation pad, connected to module GND |
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Attention: TXEN and RXEN should not be opened simultaneously at any time, as opening them simultaneously may cause direct damage to the PA module. 2. The bottom pad is connected to the internal GND and needs to be coated with silicone grease for heat dissipation or soldered to the bottom board to enhance heat dissipation. | |||
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| product model |
interface type | Chip Solution | Carrier frequency Hz | Transmission power dBm | Test distance in kilometers | air rate bps |
Packaging form | Product size mm | Product Features | technology manual |
sample buy |
|---|---|---|---|---|---|---|---|---|---|---|---|
| - | - | 410/493M | 37 | 20 | - | Patch | 45*30 | Stable performance, long transmission distance, strong penetration and diffraction ability | |||
| - | - | 868/915M | 30 | 5.0 | 1k | Patch | 27.5*18 | Long transmission distance, strong penetration and diffraction ability | |||
| - | - | 433/470M | 30 | 5.0 | 1k | Patch | 27.5*18 | Long transmission distance, strong penetration and diffraction ability | |||
| - | - | 433M | 30 | 5.0 | 1k | Patch | 23*40 | Ultra low power consumption, RF power amplifier |
-
E21-400G37S
Product model: E21-400G37S
interface type
:-
Chip Solution
:-
Carrier frequency Hz
: 410/493M
Transmission power dBm
: thirty-seven
Test distance in kilometers
: twenty
Air speed bps
-
:-
Packaging form
: Surface mount
Product size mm
: 45*30
Product features: stable performance, long transmission distance, strong penetration and diffraction ability
PDF ：
buy
E21-900G30S
Product model: E21-900G30S
interface type
:-
Chip Solution
-
:-
Carrier frequency Hz
: 868/915M
Transmission power dBm
: thirty
Test distance in kilometers
: five
Air speed bps
: 1k
Packaging form
: Surface mount
Product size mm
: 27.5*18
-
Product features: Long transmission distance, strong penetration and diffraction ability
PDF ：
buy
E21-400G30S
Product model: E21-400G30S
interface type
:-
Chip Solution
:-
Carrier frequency Hz
: 433/470M
Transmission power dBm
: thirty
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